The EU Commission endorses substantial financial assistance in Euros for establishing a semiconductor manufacturing facility in Dresden.
The European Commission endorses the massive financial support worth billions of euros for constructing TSMC, Bosch, Infineon, and NXP's chip manufacturing facilities in Dresden. The €5 billion investment aim is to secure Europe's semiconductor stockpile in accordance with the European Chip Act, as the Commission declared on Tuesday.
Furthermore, it propels the digital and ecological transformation. The announcement coincided perfectly with the forthcoming groundbreaking event for the Dresden facility, attended by German Chancellor Olaf Scholz. The ESMC's factory in Dresden is viewed as an essential component of Germany's semiconductor plan, which further encompasses the establishment of new facilities for enterprises such as Intel in Magdeburg.
TSMC will be one of the companies benefiting from the massive financial support worth billions of euros to construct chip manufacturing facilities in Dresden, as outlined in the Commission's announcement. The construction of TSMC's facility in Dresden is expected to contribute significantly to Europe's semiconductor stockpile, in line with the European Chip Act.
